TECHNOLOGY &
EQUIPMENT
With miniaturization and diversification of electronic components, Latham Industries’ state-of-the-art equipment is poised to meet your needs today and into the future.
SCREEN PRINTER
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Laser solder paste monitor delivers a low-paste warning and stops when it is too low for reliable printing
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3S (single swing squeegee) head to maintain paste volume consistency
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2D inspection to ensure optimum print quality
PICK AND PLACE
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Fully inspects ball grid array (BGA) before placing on the board (i.e., sphere size, presence, pitch, damage, etc.)
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Supports ceramic column grid array (CCGA) packages
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Wide PCB support capability from 50mm x 50mm to up to L810mm x W480mm
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High-speed multi-purpose head supports ultra-tiny chips of 0.3mm x 0.15mm (03015) to large components of 45mm x 100mm
AUTOMATED OPTICAL INSPECTION (AOI) SYSTEM
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In-Line, 3D inspection, high-speed, high-resolution 12 megapixel camera
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4-directional angular camera for precise and efficient inspection
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True color inspection ensures color integrity
REFLOW OVEN
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Ten 12.5” zones can handle the most thermally challenging assemblies, including heavy multilayer PCBs and aluminum core boards
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Closed-loop convection control provides maximum flexibility in process control
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KIC smart profiling allows us to achieve world-class thermal processes