TECHNOLOGY &
EQUIPMENT

With miniaturization and diversification of electronic components, Latham Industries’ state-of-the-art equipment is poised to meet your needs of today and tomorrow.

Printer.jpg

SCREEN PRINTER

  • Laser solder paste monitor delivers a low-paste warning and stops when it is too low for reliable printing

  • 3S (single swing squeegee) head to maintain paste volume consistency

  • 2D inspection to ensure optimum print quality

Mounter.jpg

PICK AND PLACE

  • Fully inspects ball grid array (BGA) before placing on the board (i.e., sphere size, presence, pitch, damage, etc.)

  • Also supports ceramic column grid array (CCGA) packages

  • Wide PCB support capability from 50mm x 50mm to up to L810mm x W480mm

  • High-speed multi-purpose head supports ultra-tiny chips of 0.3mm x 0.15mm (03015) to large components of 45mm x 100mm

AOI.jpg

AUTOMATED OPTICAL INSPECTION (AOI) SYSTEM

  • In-Line, 3D inspection, high-speed, high-resolution 12 megapixel camera

  • 4-directional angular camera for precise and efficient inspection

  • True color inspection ensures color integrity

ReflowOven.jpg

REFLOW OVEN

  • Ten 12.5” zones can handle the most thermally challenging assemblies, including heavy multilayer PCBs and aluminum core boards

  • Closed-loop convection control provides maximum flexibility in process control

  • KIC smart profiling allows us to achieve world-class thermal processes